2024
DFX Design For eXcellence by Axiom Electronics - PDF files
1.0 Purpose, Scope and Table of Contents
2.0 Terms and Definitions
3.0 Industry Standards and Axiom Documents
3.1 Industry Standards That Support DFM
4.0 PCBA Assembly Overview
4.1 Manufacturing Flow
4.2 Solder Paste Printing
4.3 Component Placement
4.4 Reflow soldering
4.5 Cleaning (flux removal)
4.6 Through Hole Insertion
4.7 Wave and Selective Soldering
4.8 Mechanical Assembly
4.9 Inspection and Test
5.0 Component Guidance, Surface Mounting
5.1 Component Packaging
5.2 Moisture Sensitive Devices
5.3 Capacitors
5.4 Resistors
5.5 Connectors
5.6 Sockets
5.7 Fuses
5.8 Integrated Circuit (IC) Packages
5.9 Transistors and Diodes
5.10 Resistor Networks (R-packs)
5.11 Surface Finish Options
6.0 Component Guidance, Through-Hole Mounting
6.1 Through-Hole Component Usage
6.2 Lead Protrusion
6.3 Resistors and Capacitors
6.4 Integrated Circuit (IC) Packages
6.5 Sockets
6.6 Two Way Switches
6.7 Delay Buttons
6.8 Batteries
6.9 LED Devices
6.10 Transistors and Diodes
6.11 Connectors
6.12 Surface Finish Options
7.0 Component Packages and Naming Conventions
7.1 Approved Surface Mount Components
7.2 Approved Through-Hole Mount Components
7.3 Component Naming Conventions
7.4 Reference Designator Marking Requirements
7.5 Formula for Secondary Side Mounting
8.0 Printed Circuit Board (PCB) Guidance
8.1 PCB Fabrication and Surface Finish
8.2 PCB’s per Panel and PCB Size
9.0 Common PCB DFM Issues
9.1 Material Type
9.2 Material Stackup
9.3 Trace Width and Space
9.4 Via Design (through-hole, blind and buried)
9.5 Impedance
9.6 Acid Traps
9.7 Duplicate Drill Holes
9.8 Insufficient Annular Ring
9.9 Missing Solder Mask
9.10 Missing Paste Mask
9.11 Edge Violation
9.12 Solder Mask Slivers
9.13 Copper Slivers & Islands
9.14 Silkscreen-to-Pad Violations
9.15 Copper Pad-to-Cutout
9.16 Component-to-Outline
10.0 DFM Requirements, PCB and PCBA
10.1 PCB Size and Thickness (Max and Min)
10.1.1 PCB Size and Thickness, Pad Cratering Prevention
10.1.2 BGA Size and Location, Pad Cratering Prevention
10.2 PCB Edge Clearance and Direction of Travel
10.3 PCB Tooling Hole Size and Location
10.4 Mounting Holes Used For Grounding
10.5 Fiducial Size and Location
10.6 Selective Soldering Clearance
10.7 Thermal Relief Connections
10.8 PCB Multi-Pack Framing and Removable Rails
10.9 PCB V-Scoring and Drilled Breakaway Tabs
10.10 Soldermask Defined Lands
10.11 Soldermask Clearance for Retention Clips
10.12 Gold Plated Edge Connectors and Grounding Strips
10.13 Drilled Via Pad Stack and Hole Size Recommendations
10.14 Lead to Hole Ratio Recommendations
10.15 PCB Balanced Layer Construction
10.16 Via Placement and Spacing
10.17 Via Soldermask Encroachment
10.18 Via Plugging and Filling With Soldermask
10.19 Copper Feature Edge Clearance
10.20 SMT Component Height Restrictions
10.21 Component Assembly Spacing
10.22 BGA Inspection and Rework Clearance
10.23 Obsoleted 12/12/2018
10.24 Press Fit Connector Requirements
10.25 Heatsink Attachment, Pad Cratering Prevention
10.26 High Density Interconnect Pad Stack Geometries
11.0 DFM Requirements, Land Pattern Design
11.1 Land Pattern Design, IPC-7351
11.2 Land Pattern Design, Resistors and Capacitors
11.3 Land Pattern Design, Gull Wing Leads
11.4 Land Pattern Design, J Leads
11.5 Land Pattern Design, BGA
11.6 Land Pattern Design; Leadless and Thermal Lands
2021
Design for Excellence - Department of Energy - USA - pdf file
2021
Design for Excellence in Electronics Manufacturing
Cheryl Tulkoff, Greg Caswell
John Wiley & Sons, 30-Mar-2021 - Technology & Engineering - 400 pages
DESIGN FOR EXCELLENCE IN ELECTRONICS MANUFACTURING
An authoritative guide to optimizing design for manufacturability and reliability from a team of experts
Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage.
By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book:
Contains a comprehensive review of the design and reliability of electronics
Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more
Includes technical information on electronic packaging, discrete components, and assembly processes
Shows how aspects of electronics can fail under different environmental stresses
Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.
2020
Computer Integrated Electronics Manufacturing and Testing
Arabian
CRC Press, 25-Nov-2020 - Technology & Engineering - 560 pages
Describes this process at it relates to the electronics industry, focusing on such areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge
2018
Dymax light-curable materials are one-component products and typically reach full cure in 1-30 seconds. The one-component nature and fast cure of LCMs provide
cost-reducing benefits including:
Lower Capital Costs: Dispensing systems for one-component materials cost significantly less than systems for two-component materials.
No Pot Life Problems: Two-component systems generally have pot lives measured in minutes or hours. Products with short pot life require frequent purge cycles, often resulting in clogged mixing elements.
No Hazardous Waste: Material purged from a system that remains uncured is usually classified as hazardous waste. Dymax products are one-component systems, so there is no off-ratio mixing or purging. Manufacturers can cure 100% of products, eliminating waste.
Shorter Cycle Times: Less work-in-progress and shorter lead times.
Increased Capacity: Bonding steps that may have been bottlenecks with slower systems are no longer bottlenecks.
Less Floor Space: Elimination of ovens, humidity chambers, conveyors and racks.
Easier and Better Automation: Indexing time on a line is reduced and inspection can be completed on-line. Reducing the complexity of fixturing during the curing process is also possible.
Dymax manufacturers light-curable materials for plastic sealing, metal bonding, and glass assembly, as well as for joining dissimilar substrates. Temporary maskants for protection of components during surfacing finishing operations, conformal coatings for printed circuit boards, and form in place gaskets are also available. Dymax products are utilized in a wide range applications within the appliance, medical device, electronic, aerospace and defense, and automotive industries worldwide.
https://dymax.com/light-curable-materials/
Augmentd reality for electronic assembly
https://www.lcd-module.com/index.php?id=426&L=cavzonavz%27
Fitter for Electronic and Electrical Assemblies
Skill specifications
http://pmkvyofficial.org/App_Documents/QPs/CGSC%20Fitter-%20Electrical%20and%20electronic%20assembly%20final.pdf
2017
Newnes Electronics Assembly Pocket Book
Keith Brindley
Elsevier, 26-Jul-2017 - Technology & Engineering - 304 pages
Produced in association with the Engineering Training Authority with contributions from dozens of people in the electronics industry. The material covers common skills in electrical and electronic engineering and concentrates mainly on wiring and assembly. 'Newnes Electronics Assembly Pocket Book' is for electronics technicians, students and apprentices.
New DOW CORNING® EA-5151 Quick in Connect (QiC) Adhesive Formulated to Accelerate Electronic Assembly and Increase Production Throughput
2016
Newnes Electronics Assembly Handbook
Keith Brindley
Elsevier, 30-Jun-2016 - Technology & Engineering - 354 pages
AUTOMATED PASSING OF SPECIAL CONTACT ELEMENTS FOR ELECTRONIC ASSEMBLY
By a vibration and a specially created strip for leading and positioning the contact elements conditions for automated SMD assembly were created. This enabled a large decrease in the prime cost of the products and an increase in the productivity of the whole production.
Benefits of the system for an automatic passing of components are:
- An automatic assembly of final products was possible as the problem regarding the precise assembly of contact components was solved;
-
The productivity increased 8 times, which enabled the accomplishment of the increased volume of production;
- The labor considerably reduced, which reduced the prime cost of the product considerably
- The rework rate considerably decreased. This guarantees a lack of refusals among the clients;
- The possibility of stopping work of an assembly line decreases.
INTERNATIONAL SCIENTIFIC JOURNAL "INNOVATIONS IN DISCRETE PRODUCTIONS"
YEAR IV, ISSUE 2, P.P. 31-33 (2016)
https://stumejournals.com/journals/innovations/2016/2/31/pdf
Optimasplus - Total Assembly Productivity Solution
http://www3.uic.com/wcms/Images.nsf/c06db59d70a043cc85256809004d8cbe/5eb58d7706df75cd85256b0f007a3dc9/$FILE/OptimaPlus.pdf
2014
Design assistance, claimed to maximise efficiency, flexibility and profitability while optimising space, has been introduced by Lista. ListaWorks design assistance provides custom-configurable solutions to electronics assembly workspaces. Experts examine and predict current and future storage and workspace requirements, and propose solutions that provide high-density, reduced-footprint storage and offer the greatest workspace productivity.
https://production.electronicspecifier.com/around-the-industry/assistance-for-assembly-workspaces-maximise-productivity
2013
Lista Offers Workstation Solutions for Electronic Assembly
https://production.electronicspecifier.com/component-placement/arlink-8000-align-adjustable-height-lista-offers-workstation-solutions-for-electronic-assembly
2012
Machine Vision Optimizing Electronics Production
Cognex.com
2010
Samsung Electronics: And the Struggle For Leadership of the Electronics Industry
Tony Michell
John Wiley & Sons, 28-Jun-2010 - Business & Economics - 256 pages
This book views Samsung Electronics in terms of corporate life cycle as well as product portfolio and strategy. It also examines the issues Samsung faces as it proceeds further into the 21st century.
Written from the perspective of an experienced commentator on Korean and global business, this book presents not simply a narrative or an adulatory and uncritical account of Samsung's rise, but a considered analysis of the secrets of success that both business students and CEOs will want to read and consider applying to their own companies.
http://books.google.co.in/books?id=vgZim29J3awC
SLIM: Short Cycle Time and Low Inventory in Manufacturing at Samsung Electronics
Robert C. Leachman • Jeenyoung Kang • Vincent Lin
Department of Industrial Engineering and Operations Research, University of California at Berkeley,
Berkeley, California 94720–1777
IBM Korea, Inc., MMAA Building, Dogok-dong, Gangnam-gu, Seoul, Korea 467–12
Leachman and Associates LLC, 5870 Carmel Way, Union City, California 94587
Interfaces, 2002 INFORMS
Vol. 32, No. 1, January–February 2002, pp. 61–77
India
IT Hardware Sector - Report by NMCC in 2010
Chapter 3 is on productivity
http://nmcc.nic.in/pdf/ITHardware_May2010.pdf
Updated on 6.5.2024 27.5.2022, 5 December 2018
First posted on 2 February 2014
