Thursday, December 24, 2020

PCB Assembly - Method Study - Process Industrial Engineering Exercises

Use Operation Analysis Method after preparing process chart - Operation Process Chart and Flow Process Chart.

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https://www.youtube.com/watch?v=2qk5vxWY46A
https://www.youtube.com/channel/UCLpKdGd_bgr2s5cwexaNHQw


2.

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3.
Fujitsu Mainboard Production in Augsburg Plant, West Germany

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https://www.youtube.com/watch?v=ylk6VMBLrvM



Register and Download: The State of the Market Report 2020 - Printed Circuit Board Assembly & Manufacturing

Lockheed Martin: Trailblazing Digital Transformation Using SAP IoT for Circuit Card Assembly Process
Feb 2020

SAP Internet of Things solution
15% Reduction in labor costs through process automation

Before: Challenges and Opportunities

•  Difficultly managing consumption levels for production machines, seeing production times, and gaining insight into quality defects

Built a common data format for storing all manufacturing device data
•Created an enterprise data lake for central storage of machine data to perform manufacturing analysis After: Value-Driven Results
•  Gained clear visibility into manufacturing operations. 
•  Increased insight into manufacturing operations using overall equipment effectiveness for identifying long-running processes, evaluating schedule estimates, and identifying scrap-causing defects
• Developed dashboards to show the current state of all manufacturing equipment along with hot spots happening within the manufacturing process
•  Reduced touch labor hours by analyzing real-time machine data, allowing manufacturing equipment to run unattended by notifying operators of any unexpected anomalies  

Brian Vargo, Industrial Engineer, Space Electronics Center, Lockheed Martin Corporation



Component Orientation on PCBs: Best Practices to Optimize Assembly
https://www.vse.com/blog/2020/01/21/component-orientation-on-pcbs-best-practices-to-optimize-assembly/

Designing for Optimization of Printed Circuit Board Assembly (PCBA)
Tempo Automation
August 23, 2018

Surface mounted PCB cleaning process improvement and Its impact on manufacturing system performance

Rajendran, Nikith
Thesis (M. Eng.) 2011--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.
Abstract
In the surface mount technology (SMT) assembly line, the printed circuit boards (PCB) are washed to remove the solder flux that was used while soldering to prevent oxidation. The solder flux residues cause many problems like electro-migration, improper mold underfill and increase the chances of failure. This project identifies the important factors involved in cleaning and develop alternative methods. A model of the SMT assembly line was created using ARENA software and the impact of the different alternatives on the manufacturing system's performance was analyzed using this model. The results indicate that the use of chemicals in the ultrasonic cleaning method gives the best cleanliness performance.  Cost comparison results  indicate that using chemicals in the batch type ultrasonic machine was at least 25% cheaper than using chemicals in either centrifugal machine or in in-line machine.















Updated on 25 December 2020, 15 August 2019, 18 July 2019

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