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https://www.youtube.com/watch?v=-iRnDxCSUNI
Oct 2016
MMICs - Monolithic microwave integrated circuits
Cost models attribute 50 to 75% of cost AESA (active electronically scanned array ) to antenna. Within antenna 50% of the cost is attributed to T/R modules./
AESAs have a price of $175 million for array face. Hence the price of T/R modules in an AESA can be $44 million to $65 million. Ground based arrays can have 25,000 T/R modues. Hence each T/R module may have a price of $1760 to $2600. MMICs account for 50% of the TR module cost.
Overall yields of 60 to 70% are considered normal from wafer to MMICs.
GaAS PHEMT or GaN HEMT
Within $1760, the MMIC may cost $700, HPA $350 and rest purchased items and assembly cost.
Touch labor has to be contained below $262 per module.
Breakup of T/R module cost:
MMIC: 40%
Purchased part: 20%
Assembly : 15%
Test: 10%
Qualification: 15%
So MMIC: 40% of 1750 = $700. 50% of it is high power amplifier (HPA) = $350.
Raytheon supported low cos flat panel X-band array using COTS type PCBs and demonstrated four TR channels on a common SiGe BiCMOS substrate at a reported T/R channel cost of $4.
https://books.google.co.in/books?id=jESPCwAAQBAJ&pg=PA205#v=onepage&q&f=false
Cost Factors of Fabricating a MMIC wafer
Labor - 11% of the Manufacturing Cost
Machine related consumables and energy - 43% of the Manufacturing Cost
Depreciation - 10%
Taxes - 10%
SG&A - 15%
Profit - 11%
Machine related consumables and energy - 43% of the Manufacturing Cost include cost of consumables, spare parts, materials (including cleanroom garments, wipes, face masks and tweezers) production control and facilities (power, deionized water and gas scrubbers).
Design Notes
1 Watt X-band HPA MMIC
This example shows a 1W X-band HPA MMIC design utilizing the example AWR MESFET PDK with APLAC HB, simulation switch lists, and linear power estimation using the Cripps method implemented with Output equations.
NEWS RELEASE:
Plextek RFI unveils phased array GaN MMIC reference design
CAMBRIDGE, UK: 13 July 2016 —Plextek RFI, a UK design house specialising in microwave and millimetre-wave IC design, has announced a new reference design for a GaN power amplifier (PA) MMIC for use in X-band active phased array radar applications.“Active phased arrays require numerous PAs, which need to have high efficiency, and to have a small size and relatively low cost,” said Liam Devlin, CEO of Plextek RFI. “Our new design has a die size of only 1.5mm x 2mm, which means around 2,300 PAs can be fabricated on a single 4-inch (100mm) diameter wafer. This makes the cost very competitive compared with other commercially-available MMICs offering this level of RF output power.”
The X-band GaN PA MMIC covers 9.0 – 11.5GHz and delivers 7W (+38.5dBm) of RF output power from a +29dBm input, with a Power Added Efficiency (PAE) of 42%. This means that it can be driven by readily available GaAs parts when used as the output PA stage.
Plextek RFI designed the MMIC using Keysight ADS 2015, and it was manufactured by UMS on its 0.25µm gate length GaN-on-SiC process (GH25).
“As the IC is designed and manufactured in Europe, it will have the added advantage of not being subject to US export control,” added Liam Devlin.
https://www.plextekrfi.com/about-us/press/
How to save money by using custom design GaAs MMICs
August 23, 2010 | Liam Devlin, Plextek Ltd
https://www.plextekrfi.com/wp-content/uploads/custom_gaas_mmics.pdf
Same as above in a different link
https://www.electronicsweekly.com/news/business/finance/can-custom-designed-mmics-reduce-microwave-systems-costs-2013-10/
https://en.wikipedia.org/wiki/Monolithic_microwave_integrated_circuit
Practical MMIC Design
Steve Marsh
Copyright: 2006
Pages: 376
https://us.artechhouse.com/Practical-MMIC-Design-P1009.aspx
MMIC Design Techniques for Low-Cost High-Volume Commercial Modules
Abstract:
This paper presents several MMIC design techniques that focus on module cost reduction and general MMIC component requirements relative to point-to-point and point-to-multipoint terrestrial, as well as two-way satellite, low-cost high-volume communication module needs. Currently, MMIC vendors concentrate on improving performance and reducing MMIC cost. Low-cost high-volume modules impose additional requirements relating to MMIC compatibility with module volume production processes. The MMIC design techniques discussed include: circuit compaction, use of external support components, maximizing symmetry, reduction of external connections, compatibility with automatic bonding machines, compatibility with automatic pick-and-place machines, and standardizing RF probe types. General MMIC requirements relative to module needs for both terrestrial and satellite communication links are also discussed.
Published in: 2003 33rd European Microwave Conference
Date of Conference: 2-10 Oct. 2003
https://ieeexplore.ieee.org/document/4143160
Design GaAs MMICs for best price and performance values
Atkinson, Bobby
Though the manufacturing advantages of monolithic integration and the emergence of GaAs foundaries have resulted in low-cost GaAs MMIC technology, further cost reduction can be achieved by using a foundary's standard line of circuit cells. By using a PC-based workstation with CAD software, it is possible, however, to fabricate a custom MMIC design for $10,000 or less. As an example, this low-cost approach was applied to the design and fabrication of a Ku-band oscillator. Criteria useful for selecting a good foundary are outlined, and attention is focused on MMIC computer-aided-engineering tools. A design process on an Apollo-based MMIC workstation is described and compared with that on a PC-based workstation, and protocols for exchanging data between PCs and mainframes are outlined.
Publication:
Microwaves & RF (ISSN 0745-2993), vol. 30, Feb. 1991, p. 93, 94, 96, 98, 99.
Pub Date: February 1991
https://ui.adsabs.harvard.edu/abs/1991MicWa..30...93A/abstract
Suppliers
MMIC (Monolithic microwave integrated circuit) devices offering includes ultra-wide band (UWB) power amplifiers (PA), low noise amplifier (LNA), mixers and gain blocks, drive amps, IF ICs, dividers, discrete devices and switches and other RF ICs, available in variety of package sizes or Bare Die to fit your requirements.
Our MMIC products offer substantial advantages such as ESD 4,000 volt, MSL 1, high quality and uniformity, enhanced band width 10MHz to 65GHz, 100% lead-free green products (RoHS compliant), higher performance, temperature compensated bias circuit, friendly packaging, MTBF over 100 years and more.
https://www.hypertech.co.il/product/mmic-devices/
https://www.custommmic.com/news/rounding-up-our-best-gan-rf-power-amplifier-mmics/
https://www.northropgrumman.com/BusinessVentures/Microelectronics/Products/Pages/GaNPowerAmplifiers.aspx
https://www.qorvo.com/innovation/technology/gan
http://rfhic.com/img/Guide.pdf
Research
The ilities of a system are often called life cycle properties.
settings
Packageability as an ‘Ility’ for Systems Engineering
by Rick L. Sturdivant 1,* andEdwin K. P. Chong
Systems 2017, 5(4), 48; https://doi.org/10.3390/systems5040048
https://www.mdpi.com/2079-8954/5/4/48/htm
Yi-Qun Hu, Hao Luo, Yong-Heng Shang and Fa-Xin Yu, 2014. Design of a Highly Integrated Front-End K-Band TR Module Based on LTCC Technology for Phased-Array System. Information Technology Journal, 13: 165-170.
https://scialert.net/fulltext/?doi=itj.2014.165.170
Automatized synthesis of microwave monolitic integrated circuits with spatial and astronomy applications
Start date 1 January 2007 End date 31 December 2008
Objective
In designing MMICs, the hardest problem is to select MMIC's schematic and topology to satisfy performance specifications. This task needs very qualified designers that know electronics, microwaves and technology. The MMIC design is now based on the multiple simulation and optimization of different circuit variants, such the process is very labor- and time-consuming and may lead to non-optimal solutions. This project focuses on investigating and developing methods and software for the direct synthesis of passive and active MMICs from circuit requirements. The project will be based on the new high-frequency network synthesis approaches. The methods and software developed will allow the automatic or interactive determination of MMIC's schematic and topology directly from requirements using exact models of MMIC elements. For implementing the proposed approach to MMIC design, fast MMIC element models will be constructed for specific MMIC production processes. It is planned to build fast polynomial and neuro-network models firstly for GaAs OMMIC ED02AH process and then for another GaAs, InP, SiGe or CMOS European processes that will be selected by partner teams. Within this project, it is supposed to implemented several tools for interactive and automatic synthesis of MMIC passive and active microwave circuits: LOCUS, a tool for the "visual" design of passive matching/compensated networks, GENESYN, a GA-based tool for the synthesis of matching networks, and GENEAMP, a tool for the automatic synthesis of transistor amplifiers using GAs. Also, it is planned to develop two additional software tools: SHIFTER for designing phase shifters, and IMCON for designing negative impedance converters with application to microwave active filters. It is planned to integrate MMIC synthesis tools in such the popular simulators as Microwave Office and ADS. This task supposes the careful estimation and validation of techniques, software tools, and MMIC element models developed. For this, the design and implementation of several extreme-quality MMICs with using these techniques and tools (such as low-noise and power amplifiers, phase shifters, impedance converters, and active filters) are planned. In particular, MMIC designs for spatial, astronomy and low-noise applications will include several designs with OMMIC (GaAs), NGC Indium Phosphide (InP) and WIN (GaAs). Also, as these III/V processes have difficulty meeting the cost targets and high integration density, Silicon processes will therefore be investigated with AMS and IHP (www.ihp-microelectronics.com) in a SiGe process with frequency > 200 GHz but also with UMC in a CMOS process. The designs will be based on the SOC concept integrating amplifying and filtering functions (active filters) on a single ship. In designing negative impedance converters and active filters, the specific original design techniques of XLIM group based on the "impedance profile" will be used.
The benefits and challenges of using GaN technology in AESA radar systems
MARIO LAMARCHE, MERCURY SYSTEMS
Google Books
Pseudomorphic HEMT Technology and Applications
R.L. Ross, Stefan P. Svensson, Paolo Lugli
Springer Science & Business Media, 06-Dec-2012 - Science - 350 pages
PHEMT devices and their incorporation into advanced monolithic integrated circuits is the enabling technology for modern microwave/millimeter wave system applications. Although still in its infancy, PHEMT MIMIC technology is already finding applications in both military and commercial systems, including radar, communication and automotive technologies. The successful team in a globally competitive market is one in which the solid-state scientist, circuit designer, system engineer and technical manager are cognizant of those considerations and requirements that influence each other's function.
This book provides the reader with a comprehensive review of PHEMT technology, including materials, fabrication and processing, device physics, CAD tools and modelling, monolithic integrated circuit technology and applications. Readers with a broad range of specialities in one or more of the areas of materials, processing, device physics, circuit design, system design and marketing will be introduced quickly to important basic concepts and techniques. The specialist who has specific PHEMT experience will benefit from the broad range of topics covered and the open discussion of practical issues. Finally, the publication offers an additional benefit, in that it presents a broad scope to both the researcher and manager, both of whom must be aware and educated to remain relevant in an ever-expanding technology base.
https://books.google.co.in/books?id=En71CAAAQBAJ
Wafer Cost - Estimation and Historical Record
Lecture 5: Cost, Price, and Price for Performance - BNRG
http://bnrg.eecs.berkeley.edu/~randy/Courses/CS252.S96/Lecture05.pdf
Cost per Wafer
http://smithsonianchips.si.edu/ice/cd/CEICM/SECTION2.pdf
Micro Process Engineering: Fundamentals, Devices, Fabrication, and Applications
Norbert Kockmann
John Wiley & Sons, 26-Sep-2008 - Technology & Engineering - 529 pages
This edition of 'Micro Process Engineering' was originally published in the successful series 'Advanced Micro & Nanosystems'.
Authors from leading industrial players and research institutions present a concise and didactical introduction to Micro Process Engineering, the combination of microtechnology and process engineering into a most promising and powerful tool for revolutionizing chemical processes and industrial mass production of bulk materials, fine chemicals, pharmaceuticals and many other products.
The book takes the readers from the fundamentals of engineering methods, transport processes, and fluid dynamics to device conception, simulation and modelling, control interfaces and issues of modularity and compatibility. Fabrication strategies and techniques are examined next, focused on the fabrication of suitable microcomponents from various materials such as metals, polymers, silicon, ceramics and glass.
The book concludes with actual applications and operational aspects of micro process systems, giving broad coverage to industrial efforts in America, Europe and Asia as well as laboratory equipment and education.
https://books.google.co.in/books?id=50Om_uP-YJAC
Wafer Cost - Estimation and Historical Record
Lecture 5: Cost, Price, and Price for Performance - BNRG
http://bnrg.eecs.berkeley.edu/~randy/Courses/CS252.S96/Lecture05.pdf
Cost per Wafer
http://smithsonianchips.si.edu/ice/cd/CEICM/SECTION2.pdf
BEL Invited Applications for 6 Posts MMIC Design and MMIC Testing Professionals
Bharat Electronic Limited (BEL) invited applications for the post of MMIC and MMIC Testing & Characterisation. Interested candidates can apply for the posts latest by 15 April 2017.
BEL Invited Applications for 6 Posts MMIC Design and MMIC Testing Professionals
Bharat Electronic Limited (BEL) invited applications for the post of MMIC and MMIC Testing & Characterisation. Interested candidates can apply for the posts latest by 15 April 2017.
Bharat Electronic Limited (BEL) invited applications for the post of MMIC and MMIC Testing & Characterisation. Interested candidates can apply for the posts latest by 15 April 2017.
Under Bharat Electronic Limited (BEL) Recruitment 2017, there are 6 Posts for MMIC Design and MMIC Testing & Characterisation. In which 4 Posts for Deputy Manager (MMIC Design), Senior Engineer (MMIC Design) and 2 Posts for Senior Engineer (MMIC Test & Characterization). The eligibility criteria for the above posts are listed below
For applying Deputy Manager (MMIC DESIGN) and Senior Engineer (MMIC DESIGN), candidate should have done Full time B.E/B.Tech in Electronics / Electronics & Telecommunication / Electronics & Communication / Communication / Telecommunication from reputed AICTE approved institution / University, NITs, IITS with First Class for GEN / OBC candidates & Pass Class for SC/ST/PWD Candidates. M.E/M.Tech in RF/Microwave Engineering/related specialization from reputed AICTE approved institution / University, NITs, IITs with First Class for GEN / OBC candidates & Pass Class for SC/ST/PWD Candidates. 6 Years MS from reputed AICTE approved Institutions/University in the relevant specialisation Ph.D in relevant area of RF/Microwave from reputed AICTE approved Institution / University. PH.D is not required for Senior Engineer (MMIC Design), Senior Engineer (MMIC Test & Characterization).
https://www.jagranjosh.com/articles/bel-invited-applications-for-6-posts-mmic-design-and-mmic-testing-professionals-1490264543-1
Ud 24.1.2022, 7.11.2021
Pub 20.11.2019
MMIC HPA is an interesting example to discuss blast, create and refine value analysis - value engineering technique in electronics.
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